MEMS and EFF technology based micro connector for future miniature devices

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MEMS and EFF technology based micro connector for future miniature devices

The development of a miniature; size, light and high performance electronic devices; has been accelerated for further development. In commercial stamping method, connector pitch size (radius) is more than 300μm due to its size limitation. Therefore, the stamped contact hertz stress becomes lower and...

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Bibliographic Details
Main Authors:	Bhuiyan, Moinul, Alamgir, Tarik, Bhuiyan, Munira, Kajihara, Masanori
Format:	Article
Language:	English
Published:	IOP Publishing 2013
Subjects:	TA401 Materials of engineering and construction
Online Access:	http://irep.iium.edu.my/34443/ http://irep.iium.edu.my/34443/1/MEMS_and_EFF_technology_based_micro_connector_for_future_miniature_devices.pdf

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