Design and fabrication stable LNF contact for future IC application

Enable the design of a small contact spring for applications requiring high density, high speed and high durability. A low normal force (LNF) contact spring with high performance is fabricated using a unique combined MEMS photo resist lithography and electro fine forming (EFF) technology. Reducing a...

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Main Authors: Bhuiyan, Moinul, Rashid, Muhammad Mahbubur, Ahmed, Sayem, Bhuiyan, Munira, Kajihara, Masanori
Format: Article
Language:English
Published: IOP Publishing 2013
Subjects:
Online Access:http://irep.iium.edu.my/34439/
http://irep.iium.edu.my/34439/1/Design_and_fabrication_stable_LNF_contact_for_future_IC_application.pdf
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author Bhuiyan, Moinul
Rashid, Muhammad Mahbubur
Ahmed, Sayem
Bhuiyan, Munira
Kajihara, Masanori
author_facet Bhuiyan, Moinul
Rashid, Muhammad Mahbubur
Ahmed, Sayem
Bhuiyan, Munira
Kajihara, Masanori
author_sort Bhuiyan, Moinul
building IIUM Repository
collection Online Access
description Enable the design of a small contact spring for applications requiring high density, high speed and high durability. A low normal force (LNF) contact spring with high performance is fabricated using a unique combined MEMS photo resist lithography and electro fine forming (EFF) technology. Reducing a total contact material cost of a connector, a high-Hertz stress with LNF contact will be a key technology in the future. Only radius R 5m tip with 0.1N force contact provides an excellent electrical performance which is much sharper than conventional contact. 0.30million cycle’s durability test was passed at 300m displacement and the contact resistance was ≦50mΩ.
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institution International Islamic University Malaysia
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language English
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publishDate 2013
publisher IOP Publishing
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spelling iium-344392014-07-03T07:35:05Z http://irep.iium.edu.my/34439/ Design and fabrication stable LNF contact for future IC application Bhuiyan, Moinul Rashid, Muhammad Mahbubur Ahmed, Sayem Bhuiyan, Munira Kajihara, Masanori TA174 Engineering design Enable the design of a small contact spring for applications requiring high density, high speed and high durability. A low normal force (LNF) contact spring with high performance is fabricated using a unique combined MEMS photo resist lithography and electro fine forming (EFF) technology. Reducing a total contact material cost of a connector, a high-Hertz stress with LNF contact will be a key technology in the future. Only radius R 5m tip with 0.1N force contact provides an excellent electrical performance which is much sharper than conventional contact. 0.30million cycle’s durability test was passed at 300m displacement and the contact resistance was ≦50mΩ. IOP Publishing 2013 Article PeerReviewed application/pdf en http://irep.iium.edu.my/34439/1/Design_and_fabrication_stable_LNF_contact_for_future_IC_application.pdf Bhuiyan, Moinul and Rashid, Muhammad Mahbubur and Ahmed, Sayem and Bhuiyan, Munira and Kajihara, Masanori (2013) Design and fabrication stable LNF contact for future IC application. IOP Conference Series: Materials Science and Engineering, 53 (012060). ISSN 1757-8981 http://iopscience.iop.org/1757-899X/53/1/012060 doi:10.1088/1757-899X/53/1/012060
spellingShingle TA174 Engineering design
Bhuiyan, Moinul
Rashid, Muhammad Mahbubur
Ahmed, Sayem
Bhuiyan, Munira
Kajihara, Masanori
Design and fabrication stable LNF contact for future IC application
title Design and fabrication stable LNF contact for future IC application
title_full Design and fabrication stable LNF contact for future IC application
title_fullStr Design and fabrication stable LNF contact for future IC application
title_full_unstemmed Design and fabrication stable LNF contact for future IC application
title_short Design and fabrication stable LNF contact for future IC application
title_sort design and fabrication stable lnf contact for future ic application
topic TA174 Engineering design
url http://irep.iium.edu.my/34439/
http://irep.iium.edu.my/34439/
http://irep.iium.edu.my/34439/
http://irep.iium.edu.my/34439/1/Design_and_fabrication_stable_LNF_contact_for_future_IC_application.pdf