A low normal force contact using photolithography and Ni-Co electro fine forming technology

This new technology is realized by Photo Resist Lithography and Ni-Co Electro Fine Forming technology, and enables the design of a small contact spring for applications requiring high density, high speed and high durability. The evaluation result proved the capability of Low Normal Force (0.10N-0....

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Main Authors: Bhuiyan, Moinul, Takemasa, Eiichiro
Format: Proceeding Paper
Language:English
English
Published: 2009
Subjects:
Online Access:http://irep.iium.edu.my/33437/
http://irep.iium.edu.my/33437/1/A_Low_Normal_Force_Contact_using_Photolithography_and_Ni-Co_Electro_Fine_Forming_Technology.pdf
http://irep.iium.edu.my/33437/2/Tech._Paper_Conf._Spring2009_20090515.pdf
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author Bhuiyan, Moinul
Takemasa, Eiichiro
author_facet Bhuiyan, Moinul
Takemasa, Eiichiro
author_sort Bhuiyan, Moinul
building IIUM Repository
collection Online Access
description This new technology is realized by Photo Resist Lithography and Ni-Co Electro Fine Forming technology, and enables the design of a small contact spring for applications requiring high density, high speed and high durability. The evaluation result proved the capability of Low Normal Force (0.10N-0.15N at 0.3mm) at contact point (5μm radius), durability of 100,000 contact cycles (less than 50m�). The particle size of the Ni-Co crystal must be less than 100nm as measured by STEM.
first_indexed 2025-11-14T15:38:35Z
format Proceeding Paper
id iium-33437
institution International Islamic University Malaysia
institution_category Local University
language English
English
last_indexed 2025-11-14T15:38:35Z
publishDate 2009
recordtype eprints
repository_type Digital Repository
spelling iium-334372023-05-16T07:23:02Z http://irep.iium.edu.my/33437/ A low normal force contact using photolithography and Ni-Co electro fine forming technology Bhuiyan, Moinul Takemasa, Eiichiro TA165 Engineering instruments, meters, etc. Industrial instrumentation This new technology is realized by Photo Resist Lithography and Ni-Co Electro Fine Forming technology, and enables the design of a small contact spring for applications requiring high density, high speed and high durability. The evaluation result proved the capability of Low Normal Force (0.10N-0.15N at 0.3mm) at contact point (5μm radius), durability of 100,000 contact cycles (less than 50m�). The particle size of the Ni-Co crystal must be less than 100nm as measured by STEM. 2009-05-14 Proceeding Paper PeerReviewed application/pdf en http://irep.iium.edu.my/33437/1/A_Low_Normal_Force_Contact_using_Photolithography_and_Ni-Co_Electro_Fine_Forming_Technology.pdf application/pdf en http://irep.iium.edu.my/33437/2/Tech._Paper_Conf._Spring2009_20090515.pdf Bhuiyan, Moinul and Takemasa, Eiichiro (2009) A low normal force contact using photolithography and Ni-Co electro fine forming technology. In: TE-Japan Technical Conference, 14 May 2009, Kawasaki, Japan.
spellingShingle TA165 Engineering instruments, meters, etc. Industrial instrumentation
Bhuiyan, Moinul
Takemasa, Eiichiro
A low normal force contact using photolithography and Ni-Co electro fine forming technology
title A low normal force contact using photolithography and Ni-Co electro fine forming technology
title_full A low normal force contact using photolithography and Ni-Co electro fine forming technology
title_fullStr A low normal force contact using photolithography and Ni-Co electro fine forming technology
title_full_unstemmed A low normal force contact using photolithography and Ni-Co electro fine forming technology
title_short A low normal force contact using photolithography and Ni-Co electro fine forming technology
title_sort low normal force contact using photolithography and ni-co electro fine forming technology
topic TA165 Engineering instruments, meters, etc. Industrial instrumentation
url http://irep.iium.edu.my/33437/
http://irep.iium.edu.my/33437/1/A_Low_Normal_Force_Contact_using_Photolithography_and_Ni-Co_Electro_Fine_Forming_Technology.pdf
http://irep.iium.edu.my/33437/2/Tech._Paper_Conf._Spring2009_20090515.pdf