MEMS and EFF Technology based micro connector for future miniature devices
The development of a miniature; size, light and high performance electronic devices; has been accelerated for further development. In commercial stamping method, connector pitch size (radius) is more than 300μm due to its size limitation. Therefore, the stamped contact hertz stress becomes lower...
| Main Authors: | , , , , |
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| Format: | Proceeding Paper |
| Language: | English English |
| Published: |
2013
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| Subjects: | |
| Online Access: | http://irep.iium.edu.my/33343/ http://irep.iium.edu.my/33343/1/2129_MEMS_and_EFF_Technology_based_Micro_Connector_for.pdf http://irep.iium.edu.my/33343/2/ICOM13_Programme_Book.pdf |
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| author | Bhuiyan, Md. Moinul Islam Rashid, Muhammad Mahbubur Alamgir, Tarik Bin Bhuiyan, Munira Kajihara, Masanori |
| author_facet | Bhuiyan, Md. Moinul Islam Rashid, Muhammad Mahbubur Alamgir, Tarik Bin Bhuiyan, Munira Kajihara, Masanori |
| author_sort | Bhuiyan, Md. Moinul Islam |
| building | IIUM Repository |
| collection | Online Access |
| description | The development of a miniature; size, light and high performance electronic
devices; has been accelerated for further development. In commercial stamping method,
connector pitch size (radius) is more than 300μm due to its size limitation. Therefore, the
stamped contact hertz stress becomes lower and less suitable for fine pitch connector. To
overcome this pitch size problem a narrow pitch Board-to-Board (BtoB) interface connectors
are in demand for the current commercial design. Therefore, this paper describes a fork type
micro connector design with high Hertz-Stress using MEMS and Electro Fine Forming (EFF)
fabrication techniques. The connector is designed high aspect ratio and high-density packaging
using UV thick resist and electroforming. In this study a newly fabricated micro connector’s
maximum aspect ratio is 50μm and pitch is 80μm is designed successfully which is most
compact fork-type connector in the world. When these connectors are connected, a contact
resistance of less than 50mΩ has been attained by using four-point probe technique. |
| first_indexed | 2025-11-14T15:38:19Z |
| format | Proceeding Paper |
| id | iium-33343 |
| institution | International Islamic University Malaysia |
| institution_category | Local University |
| language | English English |
| last_indexed | 2025-11-14T15:38:19Z |
| publishDate | 2013 |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | iium-333432013-12-13T07:25:33Z http://irep.iium.edu.my/33343/ MEMS and EFF Technology based micro connector for future miniature devices Bhuiyan, Md. Moinul Islam Rashid, Muhammad Mahbubur Alamgir, Tarik Bin Bhuiyan, Munira Kajihara, Masanori TA165 Engineering instruments, meters, etc. Industrial instrumentation The development of a miniature; size, light and high performance electronic devices; has been accelerated for further development. In commercial stamping method, connector pitch size (radius) is more than 300μm due to its size limitation. Therefore, the stamped contact hertz stress becomes lower and less suitable for fine pitch connector. To overcome this pitch size problem a narrow pitch Board-to-Board (BtoB) interface connectors are in demand for the current commercial design. Therefore, this paper describes a fork type micro connector design with high Hertz-Stress using MEMS and Electro Fine Forming (EFF) fabrication techniques. The connector is designed high aspect ratio and high-density packaging using UV thick resist and electroforming. In this study a newly fabricated micro connector’s maximum aspect ratio is 50μm and pitch is 80μm is designed successfully which is most compact fork-type connector in the world. When these connectors are connected, a contact resistance of less than 50mΩ has been attained by using four-point probe technique. 2013-07-02 Proceeding Paper PeerReviewed application/pdf en http://irep.iium.edu.my/33343/1/2129_MEMS_and_EFF_Technology_based_Micro_Connector_for.pdf application/pdf en http://irep.iium.edu.my/33343/2/ICOM13_Programme_Book.pdf Bhuiyan, Md. Moinul Islam and Rashid, Muhammad Mahbubur and Alamgir, Tarik Bin and Bhuiyan, Munira and Kajihara, Masanori (2013) MEMS and EFF Technology based micro connector for future miniature devices. In: IIUM Engineering Congress 2013 (ICOM '13), 2-4 Jul 2013, Berjaya Times Square Hotel, Kuala Lumpur. (Unpublished) http://www.iium.edu.my/icom2013/13/ |
| spellingShingle | TA165 Engineering instruments, meters, etc. Industrial instrumentation Bhuiyan, Md. Moinul Islam Rashid, Muhammad Mahbubur Alamgir, Tarik Bin Bhuiyan, Munira Kajihara, Masanori MEMS and EFF Technology based micro connector for future miniature devices |
| title | MEMS and EFF Technology based micro connector for future miniature devices |
| title_full | MEMS and EFF Technology based micro connector for future miniature devices |
| title_fullStr | MEMS and EFF Technology based micro connector for future miniature devices |
| title_full_unstemmed | MEMS and EFF Technology based micro connector for future miniature devices |
| title_short | MEMS and EFF Technology based micro connector for future miniature devices |
| title_sort | mems and eff technology based micro connector for future miniature devices |
| topic | TA165 Engineering instruments, meters, etc. Industrial instrumentation |
| url | http://irep.iium.edu.my/33343/ http://irep.iium.edu.my/33343/ http://irep.iium.edu.my/33343/1/2129_MEMS_and_EFF_Technology_based_Micro_Connector_for.pdf http://irep.iium.edu.my/33343/2/ICOM13_Programme_Book.pdf |