Micro connector for high packaging density fabricated by using UV Thick Photoresist

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Micro connector for high packaging density fabricated by using UV Thick Photoresist

A fork-type micro connector with high aspect ratio and high packaging density was fabricated using UV thick photoresist and Ni electroforming. A negative photoresist (THB-130N) was used as a mold of Ni electroforming. The tips of socket terminal of the micro connector were formed as movable portions...

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Bibliographic Details
Main Authors:	Unno, Toshinori, Toriyama, Toshiyuki, Bhuiyan, Moinul, Yokoyama, Yoshihiko, Sugiyama, Susumu
Format:	Article
Language:	English
Published:	Institute of Electrical Engineers of Japan 2002
Subjects:	TA401 Materials of engineering and construction
Online Access:	http://irep.iium.edu.my/33179/ http://irep.iium.edu.my/33179/1/Micro_Connector_for_High_Packaging_Density_Fabricated_by_Using_UV_Thick_Photoresist.pdf

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