Development of an economical lapping process

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Development of an economical lapping process

The manufacturing of silicon wafers in particular involves numerous processes such as grinding, lapping, and polishing of large diameter wafers employing expensive equipment in order to produce the required optical quality and damage-free surfaces. In the finishing of thin silicon chips for making I...

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Bibliographic Details
Main Authors:	Konneh, Mohamed, Tamsir, Afzeri, Triblas Adesta, Erry Yulian
Format:	Article
Language:	English
Published:	Trans Tech Publications, Switzerland 2012
Subjects:	TJ1125 Machine shops and machine shop practice
Online Access:	http://irep.iium.edu.my/28463/ http://irep.iium.edu.my/28463/2/DEVELOPMENT_OF_AN_ECONOMICAL_LAPPING_PROCESS.pdf

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