Influences of additives on copper film quality and gap filling capability of plating process
| Main Authors: | Mridha, Shahjahan, Law, Shao Beng |
|---|---|
| Format: | Book Chapter |
| Language: | English |
| Published: |
IIUM Press
2011
|
| Subjects: | |
| Online Access: | http://irep.iium.edu.my/19353/ http://irep.iium.edu.my/19353/1/chp6.pdf |
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