Development of a low cost lapping process
Conventional process of producing silicon based products uses large work-piece and it is difficult to attain high flatness of the finished surface. Thus it is not unusual to find it difficult to fine finish small area of planar surfaces and attain high degree of flatness on the finished surfaces. Th...
| Main Authors: | , , , |
|---|---|
| Format: | Proceeding Paper |
| Language: | English |
| Published: |
2009
|
| Subjects: | |
| Online Access: | http://irep.iium.edu.my/17035/ http://irep.iium.edu.my/17035/1/Paper_ID770.pdf |
| _version_ | 1848777985086193664 |
|---|---|
| author | Konneh, Mohamed Amin, A. K. M. Nurul Afzeri, Afzeri Ahmarofi, A. A. |
| author_facet | Konneh, Mohamed Amin, A. K. M. Nurul Afzeri, Afzeri Ahmarofi, A. A. |
| author_sort | Konneh, Mohamed |
| building | IIUM Repository |
| collection | Online Access |
| description | Conventional process of producing silicon based products uses large work-piece and it is difficult to attain high flatness of the finished surface. Thus it is not unusual to find it difficult to fine finish small area of planar surfaces and attain high degree of flatness on the finished surfaces. The manufacturing of silicon wafers in particular involves numerous grinding, lapping, and polishing processes of large diameter wafers employing expensive equipment in order to produce the required optical quality and damage-free surfaces. In the finishing of thin silicon chips for making IC chips especially, it is difficult to lap and/polish the substrate and obtain low surface integrity, surface finish and at the same time generate flat planar surfaces. Therefore the understanding of lapping process is very essential for economic manufacture and process improvement of thin silicon chips. A low cost lapping process has been developed, the process tried out on thin silicon chips that generated damage-free with a mirror-like surfaces of low roughness values and reasonably high degree of flatness. |
| first_indexed | 2025-11-14T14:54:41Z |
| format | Proceeding Paper |
| id | iium-17035 |
| institution | International Islamic University Malaysia |
| institution_category | Local University |
| language | English |
| last_indexed | 2025-11-14T14:54:41Z |
| publishDate | 2009 |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | iium-170352012-02-03T04:48:47Z http://irep.iium.edu.my/17035/ Development of a low cost lapping process Konneh, Mohamed Amin, A. K. M. Nurul Afzeri, Afzeri Ahmarofi, A. A. TS Manufactures Conventional process of producing silicon based products uses large work-piece and it is difficult to attain high flatness of the finished surface. Thus it is not unusual to find it difficult to fine finish small area of planar surfaces and attain high degree of flatness on the finished surfaces. The manufacturing of silicon wafers in particular involves numerous grinding, lapping, and polishing processes of large diameter wafers employing expensive equipment in order to produce the required optical quality and damage-free surfaces. In the finishing of thin silicon chips for making IC chips especially, it is difficult to lap and/polish the substrate and obtain low surface integrity, surface finish and at the same time generate flat planar surfaces. Therefore the understanding of lapping process is very essential for economic manufacture and process improvement of thin silicon chips. A low cost lapping process has been developed, the process tried out on thin silicon chips that generated damage-free with a mirror-like surfaces of low roughness values and reasonably high degree of flatness. 2009 Proceeding Paper PeerReviewed application/pdf en http://irep.iium.edu.my/17035/1/Paper_ID770.pdf Konneh, Mohamed and Amin, A. K. M. Nurul and Afzeri, Afzeri and Ahmarofi, A. A. (2009) Development of a low cost lapping process. In: International Conference on Advances in Materials & Processing Technology (AMPT 2009), 26-29 Oct., 2009, Kuala Lumpur. http://www.iium.edu.my/ampt2009/date.htm |
| spellingShingle | TS Manufactures Konneh, Mohamed Amin, A. K. M. Nurul Afzeri, Afzeri Ahmarofi, A. A. Development of a low cost lapping process |
| title | Development of a low cost lapping process |
| title_full | Development of a low cost lapping process |
| title_fullStr | Development of a low cost lapping process |
| title_full_unstemmed | Development of a low cost lapping process |
| title_short | Development of a low cost lapping process |
| title_sort | development of a low cost lapping process |
| topic | TS Manufactures |
| url | http://irep.iium.edu.my/17035/ http://irep.iium.edu.my/17035/ http://irep.iium.edu.my/17035/1/Paper_ID770.pdf |