An investigation of the mechanical behavior of a microswitch beam under thermal and electrostatic loading including cryogenic effect
Three dimensional multiphysics finite element analysis (FEA) was performed to investigate the static and dynamic responses of a micro-switch in harsh temperature environment. The temperature range for the analysis was from -60°C to 100°C. The investigated microswitch consists of a clamped-clamped be...
| Main Authors: | , , |
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| Format: | Proceeding Paper |
| Language: | English |
| Published: |
2010
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| Subjects: | |
| Online Access: | http://irep.iium.edu.my/13426/ http://irep.iium.edu.my/13426/1/An_Investigation_of_the_Mechanical_Behavior_of_a_Microswitch.pdf |
| _version_ | 1848777562840367104 |
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| author | Faris, Waleed Fekry Mohammed , H.M. Ng, Kok Heng |
| author_facet | Faris, Waleed Fekry Mohammed , H.M. Ng, Kok Heng |
| author_sort | Faris, Waleed Fekry |
| building | IIUM Repository |
| collection | Online Access |
| description | Three dimensional multiphysics finite element analysis (FEA) was performed to investigate the static and dynamic responses of a micro-switch in harsh temperature environment. The temperature range for the analysis was from -60°C to 100°C. The investigated microswitch consists of a clamped-clamped beam actuated by a bottom electrode coated with dielectric film. Coupled field simulations between the thermal, structural and electrostatic fields were performed by using the multifield solver in ANSYS. The static responses of the beam under the temperature effects were obtained from this analysis. The analysis shows that the natural frequencies were decreased with the increasing of temperature and increasing in the cryogenic range. This study will provide the designers with a tool to optimize the geometry and performance of the microswitches operated under harsh temperature environment. |
| first_indexed | 2025-11-14T14:47:58Z |
| format | Proceeding Paper |
| id | iium-13426 |
| institution | International Islamic University Malaysia |
| institution_category | Local University |
| language | English |
| last_indexed | 2025-11-14T14:47:58Z |
| publishDate | 2010 |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | iium-134262012-01-18T00:18:47Z http://irep.iium.edu.my/13426/ An investigation of the mechanical behavior of a microswitch beam under thermal and electrostatic loading including cryogenic effect Faris, Waleed Fekry Mohammed , H.M. Ng, Kok Heng TA Engineering (General). Civil engineering (General) Three dimensional multiphysics finite element analysis (FEA) was performed to investigate the static and dynamic responses of a micro-switch in harsh temperature environment. The temperature range for the analysis was from -60°C to 100°C. The investigated microswitch consists of a clamped-clamped beam actuated by a bottom electrode coated with dielectric film. Coupled field simulations between the thermal, structural and electrostatic fields were performed by using the multifield solver in ANSYS. The static responses of the beam under the temperature effects were obtained from this analysis. The analysis shows that the natural frequencies were decreased with the increasing of temperature and increasing in the cryogenic range. This study will provide the designers with a tool to optimize the geometry and performance of the microswitches operated under harsh temperature environment. 2010 Proceeding Paper PeerReviewed application/pdf en http://irep.iium.edu.my/13426/1/An_Investigation_of_the_Mechanical_Behavior_of_a_Microswitch.pdf Faris, Waleed Fekry and Mohammed , H.M. and Ng, Kok Heng (2010) An investigation of the mechanical behavior of a microswitch beam under thermal and electrostatic loading including cryogenic effect. In: 2010 Symposium on Design Test Integration and Packaging of MEMS/MOEMS (DTIP 2010), 5-7 May 2010, Seville, Spain. http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=5486507&tag=1 |
| spellingShingle | TA Engineering (General). Civil engineering (General) Faris, Waleed Fekry Mohammed , H.M. Ng, Kok Heng An investigation of the mechanical behavior of a microswitch beam under thermal and electrostatic loading including cryogenic effect |
| title | An investigation of the mechanical behavior of a microswitch beam under thermal and electrostatic loading including cryogenic effect |
| title_full | An investigation of the mechanical behavior of a microswitch beam under thermal and electrostatic loading including cryogenic effect |
| title_fullStr | An investigation of the mechanical behavior of a microswitch beam under thermal and electrostatic loading including cryogenic effect |
| title_full_unstemmed | An investigation of the mechanical behavior of a microswitch beam under thermal and electrostatic loading including cryogenic effect |
| title_short | An investigation of the mechanical behavior of a microswitch beam under thermal and electrostatic loading including cryogenic effect |
| title_sort | investigation of the mechanical behavior of a microswitch beam under thermal and electrostatic loading including cryogenic effect |
| topic | TA Engineering (General). Civil engineering (General) |
| url | http://irep.iium.edu.my/13426/ http://irep.iium.edu.my/13426/ http://irep.iium.edu.my/13426/1/An_Investigation_of_the_Mechanical_Behavior_of_a_Microswitch.pdf |