Temperature-dependent bending strength in piezoelectric semiconductive ceramics

By using theoretical analysis and three-point bending experiments, influence of temperature on the bending strength of GaN ceramics is investigated. Based on the critical fracture energy density, a simple and effective temperature-dependent bending strength prediction model is established for piezoe...

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Main Authors: Zhao, M.H., Wang, Y., Guo, C.K., Lu, Chunsheng, Xu, G.T., Qin, G.S.
Format: Journal Article
Published: Elsevier 2021
Online Access:http://hdl.handle.net/20.500.11937/86761
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author Zhao, M.H.
Wang, Y.
Guo, C.K.
Lu, Chunsheng
Xu, G.T.
Qin, G.S.
author_facet Zhao, M.H.
Wang, Y.
Guo, C.K.
Lu, Chunsheng
Xu, G.T.
Qin, G.S.
author_sort Zhao, M.H.
building Curtin Institutional Repository
collection Online Access
description By using theoretical analysis and three-point bending experiments, influence of temperature on the bending strength of GaN ceramics is investigated. Based on the critical fracture energy density, a simple and effective temperature-dependent bending strength prediction model is established for piezoelectric semiconductive ceramics. In the model, the bending strength at high temperature depends on the reference temperature, stiffness, polarization and melting point, as well as piezoelectric polarization charges. It is shown that the theoretical predictions are consistent with experimental results. Thus, such a model is instructive to the reliability design of GaN high-temperature devices.
first_indexed 2025-11-14T11:26:13Z
format Journal Article
id curtin-20.500.11937-86761
institution Curtin University Malaysia
institution_category Local University
last_indexed 2025-11-14T11:26:13Z
publishDate 2021
publisher Elsevier
recordtype eprints
repository_type Digital Repository
spelling curtin-20.500.11937-867612022-01-06T00:16:42Z Temperature-dependent bending strength in piezoelectric semiconductive ceramics Zhao, M.H. Wang, Y. Guo, C.K. Lu, Chunsheng Xu, G.T. Qin, G.S. By using theoretical analysis and three-point bending experiments, influence of temperature on the bending strength of GaN ceramics is investigated. Based on the critical fracture energy density, a simple and effective temperature-dependent bending strength prediction model is established for piezoelectric semiconductive ceramics. In the model, the bending strength at high temperature depends on the reference temperature, stiffness, polarization and melting point, as well as piezoelectric polarization charges. It is shown that the theoretical predictions are consistent with experimental results. Thus, such a model is instructive to the reliability design of GaN high-temperature devices. 2021 Journal Article http://hdl.handle.net/20.500.11937/86761 10.1016/j.ceramint.2021.10.064 Elsevier restricted
spellingShingle Zhao, M.H.
Wang, Y.
Guo, C.K.
Lu, Chunsheng
Xu, G.T.
Qin, G.S.
Temperature-dependent bending strength in piezoelectric semiconductive ceramics
title Temperature-dependent bending strength in piezoelectric semiconductive ceramics
title_full Temperature-dependent bending strength in piezoelectric semiconductive ceramics
title_fullStr Temperature-dependent bending strength in piezoelectric semiconductive ceramics
title_full_unstemmed Temperature-dependent bending strength in piezoelectric semiconductive ceramics
title_short Temperature-dependent bending strength in piezoelectric semiconductive ceramics
title_sort temperature-dependent bending strength in piezoelectric semiconductive ceramics
url http://hdl.handle.net/20.500.11937/86761