Bond Layer Properties and Geometry Effect on Interfacial Thermo-mechanical Stresses in Bi-material Electronic Packaging Assembly

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Bond Layer Properties and Geometry Effect on Interfacial Thermo-mechanical Stresses in Bi-material Electronic Packaging Assembly

Thermo-mechanical mismatch stress is one of the reasons for mechanical as well as functional failure between two or more connected devices. In electronic packaging, two or more plates or layers are bonded together by an extremely thin layer. This thin bonding layer works as an interfacial stress com...

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Bibliographic Details
Main Authors:	Debnath, Sujan, Vincent, L., Pok, Y.
Format:	Conference Paper
Published:	2018
Online Access:	http://hdl.handle.net/20.500.11937/71662

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