Bond Layer Properties and Geometry Effect on Interfacial Thermo-mechanical Stresses in Bi-material Electronic Packaging Assembly
Thermo-mechanical mismatch stress is one of the reasons for mechanical as well as functional failure between two or more connected devices. In electronic packaging, two or more plates or layers are bonded together by an extremely thin layer. This thin bonding layer works as an interfacial stress com...
| Main Authors: | , , |
|---|---|
| Format: | Conference Paper |
| Published: |
2018
|
| Online Access: | http://hdl.handle.net/20.500.11937/71662 |
| _version_ | 1848762538821419008 |
|---|---|
| author | Debnath, Sujan Vincent, L. Pok, Y. |
| author_facet | Debnath, Sujan Vincent, L. Pok, Y. |
| author_sort | Debnath, Sujan |
| building | Curtin Institutional Repository |
| collection | Online Access |
| description | Thermo-mechanical mismatch stress is one of the reasons for mechanical as well as functional failure between two or more connected devices. In electronic packaging, two or more plates or layers are bonded together by an extremely thin layer. This thin bonding layer works as an interfacial stress compliance which is expected to alleviate the interfacial stresses between the layers. Therefore, it is very important to identify the suitable interfacial bonding characteristics for reducing the interfacial thermal mismatch stresses to maintain the structural integrity. This research work examines the influences of bond layer properties and geometry on the interfacial shearing and peeling stresses in a bi-material assembly. In this study a closed form model of bi-layered assembly is used with the up-to-date bond layer shear stress compliance expression. The key bond layer properties namely Young's modulus, coefficient of thermal expansion, Poisson's ratio, and physical parameters like temperature and thickness are considered for interfacial stress evaluation. It is observed that the Young's modulus, the thickness and the temperature of the bond layer have significant influence on the interfacial shearing and peeling stress. The results obtained are likely to be useful in designing bond layer properties in microelectronics and photonics applications. |
| first_indexed | 2025-11-14T10:49:10Z |
| format | Conference Paper |
| id | curtin-20.500.11937-71662 |
| institution | Curtin University Malaysia |
| institution_category | Local University |
| last_indexed | 2025-11-14T10:49:10Z |
| publishDate | 2018 |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | curtin-20.500.11937-716622019-06-06T00:40:40Z Bond Layer Properties and Geometry Effect on Interfacial Thermo-mechanical Stresses in Bi-material Electronic Packaging Assembly Debnath, Sujan Vincent, L. Pok, Y. Thermo-mechanical mismatch stress is one of the reasons for mechanical as well as functional failure between two or more connected devices. In electronic packaging, two or more plates or layers are bonded together by an extremely thin layer. This thin bonding layer works as an interfacial stress compliance which is expected to alleviate the interfacial stresses between the layers. Therefore, it is very important to identify the suitable interfacial bonding characteristics for reducing the interfacial thermal mismatch stresses to maintain the structural integrity. This research work examines the influences of bond layer properties and geometry on the interfacial shearing and peeling stresses in a bi-material assembly. In this study a closed form model of bi-layered assembly is used with the up-to-date bond layer shear stress compliance expression. The key bond layer properties namely Young's modulus, coefficient of thermal expansion, Poisson's ratio, and physical parameters like temperature and thickness are considered for interfacial stress evaluation. It is observed that the Young's modulus, the thickness and the temperature of the bond layer have significant influence on the interfacial shearing and peeling stress. The results obtained are likely to be useful in designing bond layer properties in microelectronics and photonics applications. 2018 Conference Paper http://hdl.handle.net/20.500.11937/71662 10.1051/matecconf/201820201004 http://creativecommons.org/licenses/by/4.0/ fulltext |
| spellingShingle | Debnath, Sujan Vincent, L. Pok, Y. Bond Layer Properties and Geometry Effect on Interfacial Thermo-mechanical Stresses in Bi-material Electronic Packaging Assembly |
| title | Bond Layer Properties and Geometry Effect on Interfacial Thermo-mechanical Stresses in Bi-material Electronic Packaging Assembly |
| title_full | Bond Layer Properties and Geometry Effect on Interfacial Thermo-mechanical Stresses in Bi-material Electronic Packaging Assembly |
| title_fullStr | Bond Layer Properties and Geometry Effect on Interfacial Thermo-mechanical Stresses in Bi-material Electronic Packaging Assembly |
| title_full_unstemmed | Bond Layer Properties and Geometry Effect on Interfacial Thermo-mechanical Stresses in Bi-material Electronic Packaging Assembly |
| title_short | Bond Layer Properties and Geometry Effect on Interfacial Thermo-mechanical Stresses in Bi-material Electronic Packaging Assembly |
| title_sort | bond layer properties and geometry effect on interfacial thermo-mechanical stresses in bi-material electronic packaging assembly |
| url | http://hdl.handle.net/20.500.11937/71662 |