APA (7th ed.) Citation

Debnath, S., Vincent, L., & Pok, Y. (2018). Bond Layer Properties and Geometry Effect on Interfacial Thermo-mechanical Stresses in Bi-material Electronic Packaging Assembly.

Chicago Style (17th ed.) Citation

Debnath, Sujan, L. Vincent, and Y. Pok. Bond Layer Properties and Geometry Effect on Interfacial Thermo-mechanical Stresses in Bi-material Electronic Packaging Assembly. 2018.

MLA (9th ed.) Citation

Debnath, Sujan, et al. Bond Layer Properties and Geometry Effect on Interfacial Thermo-mechanical Stresses in Bi-material Electronic Packaging Assembly. 2018.