Themo-mechanical Interfacial Stress Analysis in Electronic Packaging at Different Temperature Conditions: Revisit Author's Work

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Themo-mechanical Interfacial Stress Analysis in Electronic Packaging at Different Temperature Conditions: Revisit Author's Work

The study of thermal mismatch induced stresses and their role in mechanical failure is one relevant topic to composite materials, photonic devices and electronic packages. Therefore, an understanding of the nature of the interfacial stresses under different temperature conditions is necessary in ord...

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Bibliographic Details
Main Authors:	Debnath, Sujan, Vincent, L., Pok, Y.
Format:	Conference Paper
Published:	2018
Online Access:	http://hdl.handle.net/20.500.11937/71437

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