APA (7th ed.) Citation

Debnath, S., Vincent, L., & Pok, Y. (2018). Themo-mechanical Interfacial Stress Analysis in Electronic Packaging at Different Temperature Conditions: Revisit Author's Work.

Chicago Style (17th ed.) Citation

Debnath, Sujan, L. Vincent, and Y. Pok. Themo-mechanical Interfacial Stress Analysis in Electronic Packaging at Different Temperature Conditions: Revisit Author's Work. 2018.

MLA (9th ed.) Citation

Debnath, Sujan, et al. Themo-mechanical Interfacial Stress Analysis in Electronic Packaging at Different Temperature Conditions: Revisit Author's Work. 2018.