Quantitative characterization of the interfacial adhesion of Ni thin film on steel substrate: a compression-induced buckling delamination test

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Quantitative characterization of the interfacial adhesion of Ni thin film on steel substrate: a compression-induced buckling delamination test

A compression-induced buckling delamination test is employed to quantitatively characterize the interfacial adhesion of Ni thin film on steel substrate. It is shown that buckles initiate from edge flaws and surface morphologies exhibit symmetric, half-penny shapes. Taking the elastoplasticity of fil...

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Bibliographic Details
Main Authors:	Zhu, W., Zhou, Y., Guo, J., Yang, L., Lu, Chunsheng
Format:	Journal Article
Published:	Pergamon 2015
Subjects:	Finite element method Interfacial adhesion Thin film Buckling Delamination
Online Access:	http://hdl.handle.net/20.500.11937/6563

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