Recovery of Sn, Ag and Cu from waste Pb-free solder using nitric acid leaching

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Recovery of Sn, Ag and Cu from waste Pb-free solder using nitric acid leaching

The development of a hydrometallurgical process for the recycling of waste Pb-free solder based on nitric acid leaching, followed by the separation of Ag and Cu through AgCl precipitation or cementation, was investigated. Nitric acid dissolved Cu and Ag from the waste material while converting tin t...

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Bibliographic Details
Main Authors:	Yoo, Kyoungkeun, Lee, J., Lee, K., Kim, B., Kim, M., Kim, S., Pandey, B.
Format:	Journal Article
Published:	Japan Institute of Metals and Materials 2012
Online Access:	http://hdl.handle.net/20.500.11937/62874

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