Thermo-Mechanical Stress Analysis in Electronic Packaging with Continuous and Partial Bond Layer

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Thermo-Mechanical Stress Analysis in Electronic Packaging with Continuous and Partial Bond Layer

Interfacial stress due to thermal mismatch in layered structure has been considered as one of the major causes of mechanical failure in electronic packaging. The mismatch due to the differences in coefficient of thermal expansion (CTE) of the materials in multi-layered structure may induce severe st...

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Bibliographic Details
Main Authors:	Debnath, Sujan, Piaw, T., Woldemichael, D.
Format:	Conference Paper
Published:	Trans Tech Publications 2014
Online Access:	http://hdl.handle.net/20.500.11937/62471

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