APA (7th ed.) Citation

Debnath, S., Piaw, T., & Woldemichael, D. (2014). Thermo-Mechanical Stress Analysis in Electronic Packaging with Continuous and Partial Bond Layer. Trans Tech Publications.

Chicago Style (17th ed.) Citation

Debnath, Sujan, T. Piaw, and D. Woldemichael. Thermo-Mechanical Stress Analysis in Electronic Packaging with Continuous and Partial Bond Layer. Trans Tech Publications, 2014.

MLA (9th ed.) Citation

Debnath, Sujan, et al. Thermo-Mechanical Stress Analysis in Electronic Packaging with Continuous and Partial Bond Layer. Trans Tech Publications, 2014.