The effect of thiourea, l(-) cysteine and glycine additives on the mechanisms and kinetics of copper electrodeposition

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The effect of thiourea, l(-) cysteine and glycine additives on the mechanisms and kinetics of copper electrodeposition

Bibliographic Details
Main Authors:	Tadesse, Bogale, Horne, M., Addai-Mensah, J.
Format:	Journal Article
Published:	Springer Netherlands 2013
Online Access:	http://hdl.handle.net/20.500.11937/57940

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