The effect of thiourea, l(-) cysteine and glycine additives on the mechanisms and kinetics of copper electrodeposition
| Main Authors: | , , |
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| Format: | Journal Article |
| Published: |
Springer Netherlands
2013
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| Online Access: | http://hdl.handle.net/20.500.11937/57940 |
| _version_ | 1848760136996225024 |
|---|---|
| author | Tadesse, Bogale Horne, M. Addai-Mensah, J. |
| author_facet | Tadesse, Bogale Horne, M. Addai-Mensah, J. |
| author_sort | Tadesse, Bogale |
| building | Curtin Institutional Repository |
| collection | Online Access |
| first_indexed | 2025-11-14T10:10:59Z |
| format | Journal Article |
| id | curtin-20.500.11937-57940 |
| institution | Curtin University Malaysia |
| institution_category | Local University |
| last_indexed | 2025-11-14T10:10:59Z |
| publishDate | 2013 |
| publisher | Springer Netherlands |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | curtin-20.500.11937-579402018-12-14T00:58:31Z The effect of thiourea, l(-) cysteine and glycine additives on the mechanisms and kinetics of copper electrodeposition Tadesse, Bogale Horne, M. Addai-Mensah, J. 2013 Journal Article http://hdl.handle.net/20.500.11937/57940 Springer Netherlands restricted |
| spellingShingle | Tadesse, Bogale Horne, M. Addai-Mensah, J. The effect of thiourea, l(-) cysteine and glycine additives on the mechanisms and kinetics of copper electrodeposition |
| title | The effect of thiourea, l(-) cysteine and glycine additives on the mechanisms and kinetics of copper electrodeposition |
| title_full | The effect of thiourea, l(-) cysteine and glycine additives on the mechanisms and kinetics of copper electrodeposition |
| title_fullStr | The effect of thiourea, l(-) cysteine and glycine additives on the mechanisms and kinetics of copper electrodeposition |
| title_full_unstemmed | The effect of thiourea, l(-) cysteine and glycine additives on the mechanisms and kinetics of copper electrodeposition |
| title_short | The effect of thiourea, l(-) cysteine and glycine additives on the mechanisms and kinetics of copper electrodeposition |
| title_sort | effect of thiourea, l(-) cysteine and glycine additives on the mechanisms and kinetics of copper electrodeposition |
| url | http://hdl.handle.net/20.500.11937/57940 |