APA (7th ed.) Citation

Tadesse, B., Horne, M., & Addai-Mensah, J. (2013). The effect of thiourea, l(-) cysteine and glycine additives on the mechanisms and kinetics of copper electrodeposition. Springer Netherlands.

Chicago Style (17th ed.) Citation

Tadesse, Bogale, M. Horne, and J. Addai-Mensah. The Effect of Thiourea, L(-) Cysteine and Glycine Additives on the Mechanisms and Kinetics of Copper Electrodeposition. Springer Netherlands, 2013.

MLA (9th ed.) Citation

Tadesse, Bogale, et al. The Effect of Thiourea, L(-) Cysteine and Glycine Additives on the Mechanisms and Kinetics of Copper Electrodeposition. Springer Netherlands, 2013.