APA (7th ed.) Citation

Tay, S., Haseeb, A., Johan, M., Munroe, P., & Quadir, M. Z. (2013). Influence of Ni nanoparticle on the morphology and growth of interfacial intermetallic compounds between Sn-3.8Ag-0.7Cu lead-free solder and copper substrate. ELSEVIER Ltd.

Chicago Style (17th ed.) Citation

Tay, S., A. Haseeb, M. Johan, P. Munroe, and Md Zakaria Quadir. Influence of Ni Nanoparticle on the Morphology and Growth of Interfacial Intermetallic Compounds Between Sn-3.8Ag-0.7Cu Lead-free Solder and Copper Substrate. ELSEVIER Ltd, 2013.

MLA (9th ed.) Citation

Tay, S., et al. Influence of Ni Nanoparticle on the Morphology and Growth of Interfacial Intermetallic Compounds Between Sn-3.8Ag-0.7Cu Lead-free Solder and Copper Substrate. ELSEVIER Ltd, 2013.