Separation of Sn from waste Pb-free Sn-Ag-Cu solder in hydrochloric acid solution with ferric chloride
A recycling process consisting of hydrochloric acid leaching with ferric chloride as an oxidant and cementation using Sn powder followed by solvent extraction was proposed to separate Sn from Pb-free solder. Leaching tests showed that the effect of HCl concentration on the leaching efficiency of Sn...
| Main Authors: | Lee, S., Yoo, Kyoungkeun, Jha, M., Lee, J. |
|---|---|
| Format: | Journal Article |
| Published: |
Elsevier
2015
|
| Online Access: | http://hdl.handle.net/20.500.11937/53385 |
Similar Items
Separation of Sn, Bi, Cu from Pb-free solder paste by ammonia leaching followed by hydrochloric acid leaching
by: Jeon, S., et al.
Published: (2017)
by: Jeon, S., et al.
Published: (2017)
Recovery of Sn, Ag and Cu from waste Pb-free solder using nitric acid leaching
by: Yoo, Kyoungkeun, et al.
Published: (2012)
by: Yoo, Kyoungkeun, et al.
Published: (2012)
Leaching of tin from waste Pb-free solder in hydrochloric acid solution with stannic chloride
by: Kim, S., et al.
Published: (2016)
by: Kim, S., et al.
Published: (2016)
Separation of Cu, Sn, Pb from copper scrap coated with Sn and Pb
by: Yoo, Kyoungkeun, et al.
Published: (2015)
by: Yoo, Kyoungkeun, et al.
Published: (2015)
Separation of Cu, Sn, Pb from photovoltaic ribbon by hydrochloric acid leaching with stannic ion followed by solvent extraction
by: Moon, G., et al.
Published: (2017)
by: Moon, G., et al.
Published: (2017)
Bismuth addition in Sn-Ag-Cu lead-free solder
by: Mohamed Ariff, Azmah Hanim, et al.
Published: (2024)
by: Mohamed Ariff, Azmah Hanim, et al.
Published: (2024)
Materials interaction during soldering and isothermal ageing of Sn-Pb and Sn-Ag-Cu solders on electroless Ni/Au surface finish
by: Tai, Siew Fong
Published: (2003)
by: Tai, Siew Fong
Published: (2003)
Potential enhancement in mechanical and physical properties of Sn-Ag-Cu lead free solder as a replacement material for Sn-Pb in electronic packaging
by: Mat Hussin, Nur Liyana, et al.
Published: (2015)
by: Mat Hussin, Nur Liyana, et al.
Published: (2015)
Study Of Wettability And Corrosion Behavior Of Sn-37pb, Sn-8zn-3bi And Sn-3ag-0.5cu Solders
by: Ridhai, Mohammed Noori
Published: (2010)
by: Ridhai, Mohammed Noori
Published: (2010)
Separation of Tin, Silver and Copper from Waste Pb-free Solder Using Hydrochloric Acid Leaching with Hydrogen Peroxide
by: Kim, S., et al.
Published: (2014)
by: Kim, S., et al.
Published: (2014)
A review on mechanical properties of SnAgCu/Cu joint using laser soldering
by: Nabila, Tamar Jaya, et al.
Published: (2018)
by: Nabila, Tamar Jaya, et al.
Published: (2018)
Intermetallic Evolution for Isothermal Aging Up To 2000hours on Sn-4ag-0.5cu and Sn-37pb Solders with Ni/Au Layers
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2013)
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2013)
Intermetallic Evolution for Isothermal Aging up to 2000 Hours on Sn-4Ag-0.5Cu and Sn-37Pb Solders with Ni/Au Layers
by: Azmah Hanim, Mohamad Ariff, et al.
Published: (2013)
by: Azmah Hanim, Mohamad Ariff, et al.
Published: (2013)
Nano Particle Reinforced Lead-Free Sn–3.0Ag–0.5Cu Solder Paste for Reflow Soldering Process
by: Chellvarajoo, Srivalli
Published: (2016)
by: Chellvarajoo, Srivalli
Published: (2016)
Nano Particle Reinforced Lead Free Sn–3.0ag–0.5cu Solder Paste For Reflow Soldering Process
by: Chellvarajoo, Srivalli
Published: (2016)
by: Chellvarajoo, Srivalli
Published: (2016)
Comparative study on the isothermal aging of bare Cu and ENImAg surface finish for Sn-Ag-Cu solder joints
by: M.A., Rabiatul Adawiyah, et al.
Published: (2018)
by: M.A., Rabiatul Adawiyah, et al.
Published: (2018)
The effect of different Sn-Ag-Cu (SAC) solder form on solder/Cu joint performance through microwave hybrid heating
by: Maliessa Nabilah, Mazelan
Published: (2023)
by: Maliessa Nabilah, Mazelan
Published: (2023)
Study of interfacial reaction during reflow soldering of Sn-Ag-Cu lead-free solders on bare coppper and immersion silver surface finishes
by: Abu Hassan, Nurfazlin
Published: (2009)
by: Abu Hassan, Nurfazlin
Published: (2009)
Interfacial reactions during soldering of Sn-Ag-Cu lead free solders on immersion silver and electroless nickel/ immersion gold surface finishes
by: Idris, Siti Rabiatull Aisha
Published: (2008)
by: Idris, Siti Rabiatull Aisha
Published: (2008)
Preparation of nano-sized tin oxide powder from waste Pb-free solder by direct nitric acid leaching
by: Yoo, Kyoungkeun, et al.
Published: (2016)
by: Yoo, Kyoungkeun, et al.
Published: (2016)
Characterization And Corrosion Behaviour Of 96.5sn-3.0ag- 0.5cu Solder On Cu Substrate At Different Reflow Reactions
by: Lee , Liu Mei
Published: (2013)
by: Lee , Liu Mei
Published: (2013)
Characterization and corrosion behaviour of 96.5Sn-3.0Ag-0.5Cu solder on Cu substrate at different reflow reactions
by: Lee, Liu Mei
Published: (2013)
by: Lee, Liu Mei
Published: (2013)
A simulation study on interfacial reaction between Sn3Ag0.5Cu and Sn0.7Cu using different substrates after reflow soldering
by: M. H., Mohd Zaki, et al.
Published: (2023)
by: M. H., Mohd Zaki, et al.
Published: (2023)
Creep And Isothermal Fatigue Behaviour Of Eutectic SnPb, SnBi And SnZn Solders For Microelectronic Packaging At Mildly Elevated Temperatures
by: Hashim, Md. Amin
Published: (2011)
by: Hashim, Md. Amin
Published: (2011)
Interfacial reaction analysis of Sn-Ag-Cu solder reinforced with 0.01wt% CNTs with isothermal aging
by: Mohamed Ariff, Azmah Hanim, et al.
Published: (2016)
by: Mohamed Ariff, Azmah Hanim, et al.
Published: (2016)
Isothermal Aging Of Sn-3.0ag-0.5cu And Sn100c Solder Alloys Processed Via Equal Channel Angular Pressing
by: Baser, Muhammad Fadlin Hazim
Published: (2020)
by: Baser, Muhammad Fadlin Hazim
Published: (2020)
Influence of multi-walled carbon nanotubes on melting temperature and microstructural evolution of Pb-free Sn-5Sb/Cu solder joint
by: Theophilus, Dele-Afolabi Temitope, et al.
Published: (2015)
by: Theophilus, Dele-Afolabi Temitope, et al.
Published: (2015)
Studies on intermetallics and physical properties of Sn-3.5Ag-1.0Cu lead free solder with Zn additive / Iziana Yahya
by: Yahya, Iziana
Published: (2016)
by: Yahya, Iziana
Published: (2016)
Investigation on mechanical, microstructural and thermal properties of Sn-0.7Cu and Sn-1Ag 0.5Cu solder alloys bearing Fe and Bi / Mohammad Hossein Mahdavifard
by: Mohammad Hossein, Mahdavifard
Published: (2017)
by: Mohammad Hossein, Mahdavifard
Published: (2017)
Study on intermetallic compound formation and growth at the solder joint interface during laser soldering using sn-ag-cu powdered compact solder on copper pad
by: Nabila, Tamar Jaya
Published: (2024)
by: Nabila, Tamar Jaya
Published: (2024)
Regeneration of Sn4+ from Sn2+ solution during electrowinning process using anion exchange membrane
by: Jung, M., et al.
Published: (2019)
by: Jung, M., et al.
Published: (2019)
Joint solder of lead free solder (Sn0.7Cu) and prrinted circuit board with various heat treatment temperatures.
by: Ariff Syakirin, Ghazalli
Published: (2007)
by: Ariff Syakirin, Ghazalli
Published: (2007)
Effect of microwave hybrid heating on mechanical properties and microstructure of Sn3.0Ag0.5Cu/Cu solder joints
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2023)
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2023)
Microstructural characteristics and mechanical properties of Sn-Ag-Cu solders with minor additions of Al and Zn / Leong Yee Mei
by: Leong , Yee Mei
Published: (2020)
by: Leong , Yee Mei
Published: (2020)
Effect of Nickel Addition into Sn-3Ag-0.5Cu on Intermetallic Compound Formation during Soldering on Copper
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2012)
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2012)
Effect of Nickel Addition into Sn-3Ag-0.5Cu on Intermetallic Compound Formation during Soldering on Copper
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2012)
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2012)
Effects of Cooling Rates on Microstructure, Wettability and Strength of Sn3.8Ag0.7Cu Solder Alloy
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2017)
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2017)
The effect of cooling rate during multiple reflow soldering on intermetallic layer of Sn-4.0 Ag-0.5Cu/ENImAg
by: M.A., Rabiatul Adawiyah, et al.
Published: (2019)
by: M.A., Rabiatul Adawiyah, et al.
Published: (2019)
Effect of Sn-xCu Solder Alloy onto Intermetallic Formation After Laser Soldering
by: Muhammad Asyraf, Abdullah, et al.
Published: (2023)
by: Muhammad Asyraf, Abdullah, et al.
Published: (2023)
Reflow soldering process for Sn3.5Ag solder on ENIG using rapid thermal processing system
by: Nor Adhila Muhammad,, et al.
Published: (2014)
by: Nor Adhila Muhammad,, et al.
Published: (2014)
Similar Items
-
Separation of Sn, Bi, Cu from Pb-free solder paste by ammonia leaching followed by hydrochloric acid leaching
by: Jeon, S., et al.
Published: (2017) -
Recovery of Sn, Ag and Cu from waste Pb-free solder using nitric acid leaching
by: Yoo, Kyoungkeun, et al.
Published: (2012) -
Leaching of tin from waste Pb-free solder in hydrochloric acid solution with stannic chloride
by: Kim, S., et al.
Published: (2016) -
Separation of Cu, Sn, Pb from copper scrap coated with Sn and Pb
by: Yoo, Kyoungkeun, et al.
Published: (2015) -
Separation of Cu, Sn, Pb from photovoltaic ribbon by hydrochloric acid leaching with stannic ion followed by solvent extraction
by: Moon, G., et al.
Published: (2017)