Separation of Sn from waste Pb-free Sn-Ag-Cu solder in hydrochloric acid solution with ferric chloride
A recycling process consisting of hydrochloric acid leaching with ferric chloride as an oxidant and cementation using Sn powder followed by solvent extraction was proposed to separate Sn from Pb-free solder. Leaching tests showed that the effect of HCl concentration on the leaching efficiency of Sn...
| Main Authors: | , , , |
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| Format: | Journal Article |
| Published: |
Elsevier
2015
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| Online Access: | http://hdl.handle.net/20.500.11937/53385 |
| _version_ | 1848759131551301632 |
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| author | Lee, S. Yoo, Kyoungkeun Jha, M. Lee, J. |
| author_facet | Lee, S. Yoo, Kyoungkeun Jha, M. Lee, J. |
| author_sort | Lee, S. |
| building | Curtin Institutional Repository |
| collection | Online Access |
| description | A recycling process consisting of hydrochloric acid leaching with ferric chloride as an oxidant and cementation using Sn powder followed by solvent extraction was proposed to separate Sn from Pb-free solder. Leaching tests showed that the effect of HCl concentration on the leaching efficiency of Sn was negligible in 1.0-2.0 kmol · m<sup>- 3</sup> HCl, and the efficiency was lower at 0.5 kmol · m<sup>- 3</sup> HCl. Higher temperature yielded higher dissolution rates of Sn and Cu in the beginning of leaching; the leaching efficiencies of Sn and Cu increased to more than 99% within 90 min, but Ag was not detected, indicating that Ag could be separated successfully from Sn and Cu. When more than 1 g of Sn powder was added to 100 ml of leach solution containing 98.1 g · m<sup>- 3</sup> Cu, Cu ions could be removed from the leach solution by the cementation reaction. In the solvent extraction test using tri-butyl phosphate (TBP) diluted with kerosene, the extraction efficiency of Sn increased with increasing TBP volume ratio in the organic phase, and 99.9% of Sn was extracted selectively by 3-time solvent extraction with 15% TBP and 1:1 O/A ratio at 30 °C. |
| first_indexed | 2025-11-14T09:55:00Z |
| format | Journal Article |
| id | curtin-20.500.11937-53385 |
| institution | Curtin University Malaysia |
| institution_category | Local University |
| last_indexed | 2025-11-14T09:55:00Z |
| publishDate | 2015 |
| publisher | Elsevier |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | curtin-20.500.11937-533852017-10-09T06:31:58Z Separation of Sn from waste Pb-free Sn-Ag-Cu solder in hydrochloric acid solution with ferric chloride Lee, S. Yoo, Kyoungkeun Jha, M. Lee, J. A recycling process consisting of hydrochloric acid leaching with ferric chloride as an oxidant and cementation using Sn powder followed by solvent extraction was proposed to separate Sn from Pb-free solder. Leaching tests showed that the effect of HCl concentration on the leaching efficiency of Sn was negligible in 1.0-2.0 kmol · m<sup>- 3</sup> HCl, and the efficiency was lower at 0.5 kmol · m<sup>- 3</sup> HCl. Higher temperature yielded higher dissolution rates of Sn and Cu in the beginning of leaching; the leaching efficiencies of Sn and Cu increased to more than 99% within 90 min, but Ag was not detected, indicating that Ag could be separated successfully from Sn and Cu. When more than 1 g of Sn powder was added to 100 ml of leach solution containing 98.1 g · m<sup>- 3</sup> Cu, Cu ions could be removed from the leach solution by the cementation reaction. In the solvent extraction test using tri-butyl phosphate (TBP) diluted with kerosene, the extraction efficiency of Sn increased with increasing TBP volume ratio in the organic phase, and 99.9% of Sn was extracted selectively by 3-time solvent extraction with 15% TBP and 1:1 O/A ratio at 30 °C. 2015 Journal Article http://hdl.handle.net/20.500.11937/53385 10.1016/j.hydromet.2015.08.016 Elsevier restricted |
| spellingShingle | Lee, S. Yoo, Kyoungkeun Jha, M. Lee, J. Separation of Sn from waste Pb-free Sn-Ag-Cu solder in hydrochloric acid solution with ferric chloride |
| title | Separation of Sn from waste Pb-free Sn-Ag-Cu solder in hydrochloric acid solution with ferric chloride |
| title_full | Separation of Sn from waste Pb-free Sn-Ag-Cu solder in hydrochloric acid solution with ferric chloride |
| title_fullStr | Separation of Sn from waste Pb-free Sn-Ag-Cu solder in hydrochloric acid solution with ferric chloride |
| title_full_unstemmed | Separation of Sn from waste Pb-free Sn-Ag-Cu solder in hydrochloric acid solution with ferric chloride |
| title_short | Separation of Sn from waste Pb-free Sn-Ag-Cu solder in hydrochloric acid solution with ferric chloride |
| title_sort | separation of sn from waste pb-free sn-ag-cu solder in hydrochloric acid solution with ferric chloride |
| url | http://hdl.handle.net/20.500.11937/53385 |