APA (7th ed.) Citation

Jeon, S., Park, I., Yoo, K., & Ryu, H. (2015). The effects of temperature and agitation speed on the leaching behaviors of tin and bismuth from spent lead free solder in nitric acid leach solution. Taylor & Francis.

Chicago Style (17th ed.) Citation

Jeon, S., I. Park, Kyoungkeun Yoo, and H. Ryu. The Effects of Temperature and Agitation Speed on the Leaching Behaviors of Tin and Bismuth from Spent Lead Free Solder in Nitric Acid Leach Solution. Taylor & Francis, 2015.

MLA (9th ed.) Citation

Jeon, S., et al. The Effects of Temperature and Agitation Speed on the Leaching Behaviors of Tin and Bismuth from Spent Lead Free Solder in Nitric Acid Leach Solution. Taylor & Francis, 2015.