Effect of solute clusters on stress relaxation behavior in Cu-Ni-P alloys

In this study, the ultrafine structures in Cu-P and Cu-Ni-P alloys have been characterized using a three-dimensional atom probe (3DAP) and transmission electron microscopy (TEM), and the stress relaxation behavior of these alloys has been explored. The results show that low-temperature annealing gre...

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Main Authors: Aruga, Y., Saxey, David, Marquis, E., Shishido, H., Sumino, Y., Cerezo, A., Smith, G.
Format: Conference Paper
Published: 2009
Online Access:http://hdl.handle.net/20.500.11937/35877
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author Aruga, Y.
Saxey, David
Marquis, E.
Shishido, H.
Sumino, Y.
Cerezo, A.
Smith, G.
author_facet Aruga, Y.
Saxey, David
Marquis, E.
Shishido, H.
Sumino, Y.
Cerezo, A.
Smith, G.
author_sort Aruga, Y.
building Curtin Institutional Repository
collection Online Access
description In this study, the ultrafine structures in Cu-P and Cu-Ni-P alloys have been characterized using a three-dimensional atom probe (3DAP) and transmission electron microscopy (TEM), and the stress relaxation behavior of these alloys has been explored. The results show that low-temperature annealing greatly improved the stress relaxation performance, especially in the Cu-Ni-P alloys. The presence of Ni-P clusters in the Cu-Ni-P alloys has been revealed. The overall improvement in properties has been analyzed in terms of variations in the dislocation density and solute atom cluster density within these materials. It is shown that clusters with small average spacing give rise to significant improvements in the stress relaxation performance, without requiring significant change in the dislocation density. © 2009 The Minerals, Metals & Materials Society and ASM International.
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spelling curtin-20.500.11937-358772017-09-13T15:22:40Z Effect of solute clusters on stress relaxation behavior in Cu-Ni-P alloys Aruga, Y. Saxey, David Marquis, E. Shishido, H. Sumino, Y. Cerezo, A. Smith, G. In this study, the ultrafine structures in Cu-P and Cu-Ni-P alloys have been characterized using a three-dimensional atom probe (3DAP) and transmission electron microscopy (TEM), and the stress relaxation behavior of these alloys has been explored. The results show that low-temperature annealing greatly improved the stress relaxation performance, especially in the Cu-Ni-P alloys. The presence of Ni-P clusters in the Cu-Ni-P alloys has been revealed. The overall improvement in properties has been analyzed in terms of variations in the dislocation density and solute atom cluster density within these materials. It is shown that clusters with small average spacing give rise to significant improvements in the stress relaxation performance, without requiring significant change in the dislocation density. © 2009 The Minerals, Metals & Materials Society and ASM International. 2009 Conference Paper http://hdl.handle.net/20.500.11937/35877 10.1007/s11661-009-0025-9 restricted
spellingShingle Aruga, Y.
Saxey, David
Marquis, E.
Shishido, H.
Sumino, Y.
Cerezo, A.
Smith, G.
Effect of solute clusters on stress relaxation behavior in Cu-Ni-P alloys
title Effect of solute clusters on stress relaxation behavior in Cu-Ni-P alloys
title_full Effect of solute clusters on stress relaxation behavior in Cu-Ni-P alloys
title_fullStr Effect of solute clusters on stress relaxation behavior in Cu-Ni-P alloys
title_full_unstemmed Effect of solute clusters on stress relaxation behavior in Cu-Ni-P alloys
title_short Effect of solute clusters on stress relaxation behavior in Cu-Ni-P alloys
title_sort effect of solute clusters on stress relaxation behavior in cu-ni-p alloys
url http://hdl.handle.net/20.500.11937/35877