Size and volume effects on the strength of microscale lead-free solder joints

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Size and volume effects on the strength of microscale lead-free solder joints

The fracture behavior of microscale lead-free Sn-3.0Ag-0.5Cu solder joints of different sizes was investigated under quasistatic microtension loading. The experimental results show that the ultimate tensile strength of a joint does not always increase with decreasing thickness-to-diameter ratio (d/t...

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Bibliographic Details
Main Authors:	Yin, L., Zhang, X., Lu, Chungsheng
Format:	Journal Article
Published:	Springer 2009
Online Access:	http://hdl.handle.net/20.500.11937/22157

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