Size and volume effects on the strength of microscale lead-free solder joints
The fracture behavior of microscale lead-free Sn-3.0Ag-0.5Cu solder joints of different sizes was investigated under quasistatic microtension loading. The experimental results show that the ultimate tensile strength of a joint does not always increase with decreasing thickness-to-diameter ratio (d/t...
| Main Authors: | , , |
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| Format: | Journal Article |
| Published: |
Springer
2009
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| Online Access: | http://hdl.handle.net/20.500.11937/22157 |
| _version_ | 1848750791965278208 |
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| author | Yin, L. Zhang, X. Lu, Chungsheng |
| author_facet | Yin, L. Zhang, X. Lu, Chungsheng |
| author_sort | Yin, L. |
| building | Curtin Institutional Repository |
| collection | Online Access |
| description | The fracture behavior of microscale lead-free Sn-3.0Ag-0.5Cu solder joints of different sizes was investigated under quasistatic microtension loading. The experimental results show that the ultimate tensile strength of a joint does not always increase with decreasing thickness-to-diameter ratio (d/t), which is commonly regarded as the dominant factor for mechanical constraint in the joint. A clear joint volume effect on the strength has been found, i.e., the joint's strength increases with decreasing joint volume and the correlation follows an inverse proportional function reasonably well. |
| first_indexed | 2025-11-14T07:42:27Z |
| format | Journal Article |
| id | curtin-20.500.11937-22157 |
| institution | Curtin University Malaysia |
| institution_category | Local University |
| last_indexed | 2025-11-14T07:42:27Z |
| publishDate | 2009 |
| publisher | Springer |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | curtin-20.500.11937-221572017-09-13T15:58:24Z Size and volume effects on the strength of microscale lead-free solder joints Yin, L. Zhang, X. Lu, Chungsheng The fracture behavior of microscale lead-free Sn-3.0Ag-0.5Cu solder joints of different sizes was investigated under quasistatic microtension loading. The experimental results show that the ultimate tensile strength of a joint does not always increase with decreasing thickness-to-diameter ratio (d/t), which is commonly regarded as the dominant factor for mechanical constraint in the joint. A clear joint volume effect on the strength has been found, i.e., the joint's strength increases with decreasing joint volume and the correlation follows an inverse proportional function reasonably well. 2009 Journal Article http://hdl.handle.net/20.500.11937/22157 10.1007/s11664-009-0858-4 Springer restricted |
| spellingShingle | Yin, L. Zhang, X. Lu, Chungsheng Size and volume effects on the strength of microscale lead-free solder joints |
| title | Size and volume effects on the strength of microscale lead-free solder joints |
| title_full | Size and volume effects on the strength of microscale lead-free solder joints |
| title_fullStr | Size and volume effects on the strength of microscale lead-free solder joints |
| title_full_unstemmed | Size and volume effects on the strength of microscale lead-free solder joints |
| title_short | Size and volume effects on the strength of microscale lead-free solder joints |
| title_sort | size and volume effects on the strength of microscale lead-free solder joints |
| url | http://hdl.handle.net/20.500.11937/22157 |