Size and volume effects on the strength of microscale lead-free solder joints
The fracture behavior of microscale lead-free Sn-3.0Ag-0.5Cu solder joints of different sizes was investigated under quasistatic microtension loading. The experimental results show that the ultimate tensile strength of a joint does not always increase with decreasing thickness-to-diameter ratio (d/t...
| Main Authors: | , , |
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| Format: | Journal Article |
| Published: |
Springer
2009
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| Online Access: | http://hdl.handle.net/20.500.11937/22157 |
| Summary: | The fracture behavior of microscale lead-free Sn-3.0Ag-0.5Cu solder joints of different sizes was investigated under quasistatic microtension loading. The experimental results show that the ultimate tensile strength of a joint does not always increase with decreasing thickness-to-diameter ratio (d/t), which is commonly regarded as the dominant factor for mechanical constraint in the joint. A clear joint volume effect on the strength has been found, i.e., the joint's strength increases with decreasing joint volume and the correlation follows an inverse proportional function reasonably well. |
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