Bottom-up assembly of metallic germanium

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Bottom-up assembly of metallic germanium

Extending chip performance beyond current limits of miniaturisation requires new materials and functionalities that integrate well with the silicon platform. Germanium fits these requirements and has been proposed as a high-mobility channel material, a light emitting medium in silicon-integrated las...

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Bibliographic Details
Main Authors:	Scappucci, G., Klesse, W., Yeoh, L.A., Carter, Damien, Warschkow, O., Marks, Nigel, Jaeger, D.L., Capellini, G., Simmons, M.Y., Hamilton, A.
Format:	Journal Article
Published:	Nature Publishing Group 2015
Online Access:	http://hdl.handle.net/20.500.11937/21833

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