Search Results - Yamin, A.F.M.

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  1. 1
    Damage progression in BGA solder joints during board-level drop test

    Damage progression in BGA solder joints during board-level drop test by Yamin, A.F.M., Shaffiar, Norhashimah, Loh, W.K., Tamin, M.N.

    Published 2011
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  2. 2
    Fatigue failure processes in pb-free solder joints using continuum damage and cohesive zone models

    Fatigue failure processes in pb-free solder joints using continuum damage and cohesive zone models by Shaffiar, Norhashimah, Yamin, A.F.M., Loh, W.K., Tamin, M.N.

    Published 2012
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  3. 3
    Extended cohesive zone model for simulation of solder/IMC interface cyclic damage process in pb-free solder interconnects

    Extended cohesive zone model for simulation of solder/IMC interface cyclic damage process in pb-free solder interconnects by Yamin, A.F.M., Shaffiar, N.M., Loh, W.K., Tamin, M.N.

    Published 2012
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  4. 4
    Influence of Material Properties on the Fluid-Structure Interaction aspects during Molded Underfill Process

    Influence of Material Properties on the Fluid-Structure Interaction aspects during Molded Underfill Process by Khor, C.Y., Ishak, Muhammad Ikman, Rosli, M.U., Jamalludin, Mohd Riduan, Zakaria, M.S, Yamin, A.F.M., Abdul Aziz, M.S., Abdullah, M.Z.

    Published 2017
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