Search Results - Vincent, L.

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  1. 1
    Themo-mechanical Interfacial Stress Analysis in Electronic Packaging at Different Temperature Conditions: Revisit Author's Work

    Themo-mechanical Interfacial Stress Analysis in Electronic Packaging at Different Temperature Conditions: Revisit Author's Work by Debnath, Sujan, Vincent, L., Pok, Y.

    Published 2018
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  2. 2
    Bond Layer Properties and Geometry Effect on Interfacial Thermo-mechanical Stresses in Bi-material Electronic Packaging Assembly

    Bond Layer Properties and Geometry Effect on Interfacial Thermo-mechanical Stresses in Bi-material Electronic Packaging Assembly by Debnath, Sujan, Vincent, L., Pok, Y.

    Published 2018
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  3. 3
    Material Selection for Interfacial Bond Layer in Electronic Packaging

    Material Selection for Interfacial Bond Layer in Electronic Packaging by Debnath, Sujan, Vincent, L., Pok, Y.

    Published 2018
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