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    Improved engineering model for interfacial shearing stress analysis of a heated three layered structure in Electronic Packaging

    Improved engineering model for interfacial shearing stress analysis of a heated three layered structure in Electronic Packaging by Debnath, Sujan, Murthy, M., Seetharamu, K., Hassan, A.

    Published 2009
    Other Authors: “…University Technology Mara…”
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