Search Results - Prof. A Kiet Tieu

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    Performance study of solder bond on thermal mismatch stresses in electronic packaging assembly

    Performance study of solder bond on thermal mismatch stresses in electronic packaging assembly by Debnath, Sujan, Pang, X., Rahman, Ekhlasur, Moola, Mohan Reddy

    Published 2012
    Other Authors: “…Prof. A Kiet Tieu…”
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