Search Results - Pok, Y.

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  1. 1
    Themo-mechanical Interfacial Stress Analysis in Electronic Packaging at Different Temperature Conditions: Revisit Author's Work

    Themo-mechanical Interfacial Stress Analysis in Electronic Packaging at Different Temperature Conditions: Revisit Author's Work by Debnath, Sujan, Vincent, L., Pok, Y.

    Published 2018
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  2. 2
    Bond Layer Properties and Geometry Effect on Interfacial Thermo-mechanical Stresses in Bi-material Electronic Packaging Assembly

    Bond Layer Properties and Geometry Effect on Interfacial Thermo-mechanical Stresses in Bi-material Electronic Packaging Assembly by Debnath, Sujan, Vincent, L., Pok, Y.

    Published 2018
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  3. 3
    Material Selection for Interfacial Bond Layer in Electronic Packaging

    Material Selection for Interfacial Bond Layer in Electronic Packaging by Debnath, Sujan, Vincent, L., Pok, Y.

    Published 2018
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  4. 4
    Effect of Bond Layer Properties to Thermo-Mechanical Stresses in Flip Chip Packaging

    Effect of Bond Layer Properties to Thermo-Mechanical Stresses in Flip Chip Packaging by Pok, Y., Debnath, Sujan, Rahman, Muhammad, Dol, S.

    Published 2017
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  5. 5
    The study of solid circulation rate in a compartmented fluidized bed gasifier (CFBG)

    The study of solid circulation rate in a compartmented fluidized bed gasifier (CFBG) by Wee, S., Pok, Y., Law, Ming, Lee, V.

    Published 2016
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