Search Results - Pathirana, V.

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  1. 1
    Impact of underfill and other physical dimensions on Silicon Lateral IGBT package reliability using computer model with discrete and continuous design variables

    Impact of underfill and other physical dimensions on Silicon Lateral IGBT package reliability using computer model with discrete and continuous design variables by Rajaguru, P., Lu, H., Bailey, C., Castellazzi, A., Pathirana, V., Udugampola, N., Udrea, F.

    Published 2018
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  2. 2
    Chip-on-board assembly of 800V Si L-IGBTs for high performance ultra-compact LED drivers

    Chip-on-board assembly of 800V Si L-IGBTs for high performance ultra-compact LED drivers by Aliyu, Attahir Murtala, Mouawad, Bassem, Castellazzi, Alberto, Rajaguru, P., Bailey, C., Pathirana, V., Udugampola, N., Trajkovic, T., Udrea, F.

    Published 2017
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  3. 3
    Co-design/simulation of flip-chip assembly for high voltage IGBT packages

    Co-design/simulation of flip-chip assembly for high voltage IGBT packages by Rajaguru, P., Bailey, Christopher, Aliyu, Attahir Murtala, Castellazzi, Alberto, Pathirana, V., Udugampola, N., Trajkovic, T., Udrea, F., Mitchelson, P.D., Elliot, A.D.T.

    Published 2017
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