Search Results - Ourdjini, Ali

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  1. 1
    ffect of microstructures on the hydrogen attack to gamma titanium aluminide at low temperature

    ffect of microstructures on the hydrogen attack to gamma titanium aluminide at low temperature by Hamzah, E., Suardi, K., Ourdjini, Ali

    Published 2005
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  2. 2
    The Effectiveness of Bismuth Addition to Retard the Intermetallic Compound Formation

    The Effectiveness of Bismuth Addition to Retard the Intermetallic Compound Formation by Siti Rabiatull Aisha, Idris, Ourdjini, Ali, Saliza Azlina, Osman

    Published 2016
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  3. 3
    The effect of nickel doping on SAC305 lead-free solders and EN(B)EPIG surface finish

    The effect of nickel doping on SAC305 lead-free solders and EN(B)EPIG surface finish by Osman, Saliza Azlina, Ourdjini, Ali, Mohamed Ariff, Azmah Hanim

    Published 2014
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  4. 4
    Suppression of mold-metal reactions during investment casting

    Suppression of mold-metal reactions during investment casting by Idris, Mohd. Hasbullah, Ourdjini, Ali, Hamzah, Esah, Clegg, Allen

    Published 2000
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  5. 5
    Rheological behavior and stability of cassava starch for ceramic mould binder application

    Rheological behavior and stability of cassava starch for ceramic mould binder application by Alias, Tuti Yasmin, Idris, Mohd Hasbullah, Ahmad, Zuraida, Ourdjini, Ali

    Published 2012
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  6. 6
    Effect of Reflow Profile on Intermetallic Compound Formation

    Effect of Reflow Profile on Intermetallic Compound Formation by Siti Rabiatull Aisha, Idris, Ourdjini, Ali, Azmah Hanim, Mohamad Ariff, Saliza Azlina, Osman

    Published 2013
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  7. 7
    Adhesion Strength of HFCVD Diamond Coating on WC Substrate Seeded with Diamond and Different Ratios of SiC Powders

    Adhesion Strength of HFCVD Diamond Coating on WC Substrate Seeded with Diamond and Different Ratios of SiC Powders by Mas Ayu, Hassan, Engku Mohammad, Nazim, Sudin, Izman, Ourdjini, Ali, Tuty, Abu Bakar

    Published 2014
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  8. 8
    Development of Diffusion Barrier Layer on Copper-Printed Circuit Board Using Electroless Plating Method

    Development of Diffusion Barrier Layer on Copper-Printed Circuit Board Using Electroless Plating Method by Siti Rabiatull Aisha, Idris, Ourdjini, Ali, Azmah Hanim, Mohamad Ariff, Saliza Azlina, Osman

    Published 2015
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  9. 9
    Intermetallic Evolution for Isothermal Aging Up To 2000hours on Sn-4ag-0.5cu and Sn-37pb Solders with Ni/Au Layers

    Intermetallic Evolution for Isothermal Aging Up To 2000hours on Sn-4ag-0.5cu and Sn-37pb Solders with Ni/Au Layers by Siti Rabiatull Aisha, Idris, Azmah Hanim, Mohamad Ariff, Ourdjini, Ali, Saliza Azlina, Osman

    Published 2013
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  10. 10
    Thermal Cyclic Test For Sn-4Ag-0.5Cu Solders On High P Ni/Au AND Ni/Pd/Au Surface Finishes

    Thermal Cyclic Test For Sn-4Ag-0.5Cu Solders On High P Ni/Au AND Ni/Pd/Au Surface Finishes by Azmah Hanim, Mohamad Ariff, Ourdjini, Ali, Siti Rabiatull Aisha, Idris, Saliza Azlina, Osman

    Published 2015
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  11. 11
    Effect of Reflow Soldering Profile on Intermetallic Compound Formation

    Effect of Reflow Soldering Profile on Intermetallic Compound Formation by Siti Rabiatull Aisha, Idris, Ourdjini, Ali, Azmah Hanim, Mohamad Ariff, Saliza Azlina, Osman

    Published 2015
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  12. 12
    Intermetallic Evolution for Isothermal Aging up to 2000 Hours on Sn-4Ag-0.5Cu and Sn-37Pb Solders with Ni/Au Layers

    Intermetallic Evolution for Isothermal Aging up to 2000 Hours on Sn-4Ag-0.5Cu and Sn-37Pb Solders with Ni/Au Layers by Azmah Hanim, Mohamad Ariff, Ourdjini, Ali, Saliza Azlina, Osman, Siti Rabiatull Aisha, Idris

    Published 2013
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  13. 13
    Thermal cyclic test for Sn-4Ag-0.5Cu solders on high P Ni/Au and Ni/Pd/Au surface finishes

    Thermal cyclic test for Sn-4Ag-0.5Cu solders on high P Ni/Au and Ni/Pd/Au surface finishes by Mohamed Ariff, Azmah Hanim, Ourdjini, Ali, Idris, Siti Rabiatul Aisha, Osman, Saliza Azlina

    Published 2015
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  14. 14
    Effect of isothermal aging 2000 hours on intermetallics formed between Ni-Pd-Au with Sn-4Ag-0.5Cu solders

    Effect of isothermal aging 2000 hours on intermetallics formed between Ni-Pd-Au with Sn-4Ag-0.5Cu solders by Mohamed Ariff, Azmah Hanim, Ourdjini, Ali, Idris, Siti Rabiatul Aisha, Osman, Saliza Azlina

    Published 2013
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