Search Results - O. Saliza, Azlina

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  1. 1
    Comparative study on the isothermal aging of bare Cu and ENImAg surface finish for Sn-Ag-Cu solder joints

    Comparative study on the isothermal aging of bare Cu and ENImAg surface finish for Sn-Ag-Cu solder joints by M.A., Rabiatul Adawiyah, O., Saliza Azlina

    Published 2018
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  2. 2
    Interfacial reaction between SAC305 lead–free solders and ENImAg surface finish and bare copper

    Interfacial reaction between SAC305 lead–free solders and ENImAg surface finish and bare copper by M.A., Rabiatul Adawiyah, O., Saliza Azlina

    Published 2017
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  3. 3
    Impact of multiple reflow on intermetallic compound of nickel-doped tin-silver-copper on ENImAg substrate

    Impact of multiple reflow on intermetallic compound of nickel-doped tin-silver-copper on ENImAg substrate by M.A., Rabiatul Adawiyah, S.A., Amirul, O., Saliza Azlina, H., Syafiq

    Published 2020
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  4. 4
    Microstructural and shear strength properties of GNSs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish

    Microstructural and shear strength properties of GNSs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish by K., Vidyatharran, M. A., Azmah Hanim, Dele-Afolabi, T. T., Matori, K. A., O., Saliza Azlina

    Published 2021
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  5. 5
    Microstructural and shear strength properties of RHA-reinforced Sn–0.7Cu composite solder joints on bare Cu and ENIAg surface finish

    Microstructural and shear strength properties of RHA-reinforced Sn–0.7Cu composite solder joints on bare Cu and ENIAg surface finish by M. A., Azmah Hanim, N., Muhamad Kamil, Wei, Chuan Khang, T. T., Dele‑Afolabi, O., Saliza Azlina

    Published 2020
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  6. 6
    Interfacial microstructure evolution and shear strength of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish

    Interfacial microstructure evolution and shear strength of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish by Dele-Afolabi, T. T., M. A., Azmah Hanim, K., Vidyatharran, K. A., Matori, O., Saliza Azlina, R., Calin

    Published 2022
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  7. 7
    Interfacial microstructure evolution and shear strength of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish

    Interfacial microstructure evolution and shear strength of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish by Dele-Afolabi, Temitope T., Hanim, M. A. Azmah, Vidyatharran, K., Amin Matori, Khamirul Amin, O. Saliza, Azlina, Recep, Çalin

    Published 2022
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  8. 8
    The effect of cooling rate during multiple reflow soldering on intermetallic layer of Sn-4.0 Ag-0.5Cu/ENImAg

    The effect of cooling rate during multiple reflow soldering on intermetallic layer of Sn-4.0 Ag-0.5Cu/ENImAg by M.A., Rabiatul Adawiyah, A.B., M. Hafiz, O., Saliza Azlina, J., Zolhafizi, W.M., Wan Nur Azrina, O., Shahrul Azmir

    Published 2019
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