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Murthy, M
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1
The study of dipole moment of some substituted acetic acids in an electronically excited state
by
Murthy, M
Published 2003
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2
WLAN-GPRS Tight Coupling Based Interworking Architecture with Vertical Handoff Support
by
Phiri, Fredson Alfred
,
Murthy, M
. B. R.
Published 2007
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3
Effect of bond layer on Bi-Material Assembly subjected to Uniform Temperature Change
by
Debnath, Sujan
,
Woldemichael, Dereje
,
Murthy, M
.
,
Seetharamu, K.
Published 2011
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4
Improved engineering model for interfacial shearing stress analysis of a heated three layered structure in Electronic Packaging
by
Debnath, Sujan
,
Murthy, M
.
,
Seetharamu, K.
,
Hassan, A.
Published 2009
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5
Measurements on polar liquids at a microwave frequency — evaluation of molecular parameters — a new method
by
Murthy, M
. B. R.
,
Dyasagar, B. S.
,
Patil, R. L.
Published 2003
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6
Pitch and roll derivatives of a delta wing with curved leading edge in high speed flow
by
Ghosh, K
,
Murthy, M
,
Khan, Sher Afghan
,
Pandey, P K
Published 1990
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7
Radio resource management for WLAN networks through power control
by
Dafalla, Z. I.
,
Murthy, M
. B. R.
,
Clement, S.
,
Tan, T. C. T.
Published 2005
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8
A novel scheme of load forecasting pertaining to long term planning of a distribution system
by
Chaturvedi, , A
,
Murthy, , M
. B. R.
,
Ranjan, , R.
,
Prasad, , K.
Published 2006
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9
Bi-layered model of interfacial thermal stresses with the effect of different temperatures in the layers
by
Debnath, Sujan
,
Rahman, Muhammad
,
Woldemichael, Dereje
,
Murthy, M
.
,
Seetharamu, K.
Published 2011
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10
Effect of Different Uniform Temperature with Thickness-Wise Linear Temperature Gradient on Interfacial Stresses of a Bi-Material Assembly
by
Debnath, Sujan
,
Oo, Zeya
,
Murthy, M
.V.V.
,
Seetharamu, K.N.
Published 2010
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11
Effect of differential uniform temperature with thickness-wise linear temperature gradient oninterfacial stresses of a bi-material assembly
by
Debnath, Sujan
,
Oo, Zeya
,
Murthy, M
. V. V.
,
Seetharamu, K. N.
Published 2009
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12
Morphological approach to extract ridge and valley connectivity networks from Digital Elevation Models
by
Sagar, B. S. Daya
,
Murthy, M
. B. R.
,
Rao, C. Babu
,
Raj, Baldev
Published 2003
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13
An accurate solution for thermo-mechanical stresses in tri-material assembly in electronic packages
by
Sujan, ., D
,
Sridhar, , T. S.
,
Seetharamu, , K. N.
,
Murthy,, M
. V. V.
,
Hassan,, A. Y.
Published 2006
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