Search Results - Mouawad, Bassem

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  1. 1
    Dynamic performance analysis of a 3.3 kV SiC MOSFET half-bridge module with parallel chips and body-diode freewheeling

    Dynamic performance analysis of a 3.3 kV SiC MOSFET half-bridge module with parallel chips and body-diode freewheeling by Hussein, Abdallah, Mouawad, Bassem, Castellazzi, Alberto

    Published 2018
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  2. 2
    3.3 kV SiC JBS diode configurable rectifier module

    3.3 kV SiC JBS diode configurable rectifier module by Mouawad, Bassem, Wang, Zhenyu, Buettner, J., Castellazzi, Alberto

    Published 2017
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  3. 3
    Hybrid half-bridge package for high voltage application

    Hybrid half-bridge package for high voltage application by Mouawad, Bassem, Li, Jianfeng, Castellazzi, Alberto, Johnson, Christopher Mark

    Published 2015
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  4. 4
    Reliable integration of a high performance multi-chip half-bridge SiC power module

    Reliable integration of a high performance multi-chip half-bridge SiC power module by Mouawad, Bassem, Li, Jianfeng, Castellazzi, Alberto, Johnson, Christopher Mark

    Published 2016
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  5. 5
    Low parasitic inductance multi-chip SiC devices packaging technology

    Low parasitic inductance multi-chip SiC devices packaging technology by Li, Jianfeng, Mouawad, Bassem, Castellazzi, Alberto, Friedrichs, Peter, Johnson, Christopher Mark

    Published 2016
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  6. 6
    Novel silicon carbide integrated power module for EV application

    Novel silicon carbide integrated power module for EV application by Mouawad, Bassem, Espina, Jordi, Li, Jianfeng, Empringham, Lee, Johnson, Christopher Mark

    Published 2018
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  7. 7
    Low inductance 2.5kV packaging technology for SiC switches

    Low inductance 2.5kV packaging technology for SiC switches by Mouawad, Bassem, Li, Jianfeng, Castellazzi, Alberto, Johnson, Christopher Mark, Erlbacher, Tobias, Friedriches, Peter

    Published 2016
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  8. 8
    A thermal cycling reliability study of ultrasonically bonded copper wires

    A thermal cycling reliability study of ultrasonically bonded copper wires by Arjmand, Elaheh, Agyakwa, Pearl A., Corfield, Martin R., Li, Jianfeng, Mouawad, Bassem, Mark Johnson, C.

    Published 2016
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  9. 9
    A wire-bond-less 10 KV SiC MOSFET power module with reduced common-mode noise and electric field

    A wire-bond-less 10 KV SiC MOSFET power module with reduced common-mode noise and electric field by DiMarino, C., Mouawad, Bassem, Skuriat, Robert, Li, Ke, Xu, L., Johnson, Christopher Mark, Boroyevich, D.

    Published 2018
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  10. 10
    Chip-on-board assembly of 800V Si L-IGBTs for high performance ultra-compact LED drivers

    Chip-on-board assembly of 800V Si L-IGBTs for high performance ultra-compact LED drivers by Aliyu, Attahir Murtala, Mouawad, Bassem, Castellazzi, Alberto, Rajaguru, P., Bailey, C., Pathirana, V., Udugampola, N., Trajkovic, T., Udrea, F.

    Published 2017
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  11. 11
    Cost effective direct-substrate jet impingement cooling concept for power application

    Cost effective direct-substrate jet impingement cooling concept for power application by Mouawad, Bassem, Abebe, Robert, Skuriat, Robert, Li, Jianfeng, De Lillo, Liliana, Empringham, Lee, Johnson, C. Mark, Roberts, Andy, Clarke, Robert, Haynes, Geoff

    Published 2018
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