Search Results - Mark Johnson, C.

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    A thermal cycling reliability study of ultrasonically bonded copper wires

    A thermal cycling reliability study of ultrasonically bonded copper wires by Arjmand, Elaheh, Agyakwa, Pearl A., Corfield, Martin R., Li, Jianfeng, Mouawad, Bassem, Mark Johnson, C.

    Published 2016
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