Search Results - Khor , Chu Yee

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  1. 1
    CFD Simulation Of Underfill Encapsulation Process In Flip Chip Packaging With Various Dispensing Methods

    CFD Simulation Of Underfill Encapsulation Process In Flip Chip Packaging With Various Dispensing Methods by Khor , Chu Yee

    Published 2010
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  2. 2
    Investigation Of The Fluid/Structure Interaction In Moulded Underfill Process

    Investigation Of The Fluid/Structure Interaction In Moulded Underfill Process by Khor, Chu Yee

    Published 2013
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