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Johnson, C.M.
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1
Reliability of thick Al wire: a study of the effects of wire bonding parameters on thermal cycling degradation rate using non-destructive methods
by
Arjmand, E.
,
Agyakwa, P.A.
,
Johnson, C.M
.
Published 2014
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2
Calibration of a novel microstructural damage model for wire bonds
by
Yang, L.
,
Agyakwa, P.A.
,
Johnson, C.M
.
Published 2014
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