Search Results - Johnson, C. Mark

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  1. 1
    Physics-of-failure lifetime prediction models for wire bond interconnects in power electronic modules

    Physics-of-failure lifetime prediction models for wire bond interconnects in power electronic modules by Yang, Li, Agyakwa, Pearl A., Johnson, C. Mark

    Published 2013
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  2. 2
    Response to comments on “A numerical method to determine interdiffusion coefficients of Cu6Sn5 and Cu3Sn intermetallic compounds”

    Response to comments on “A numerical method to determine interdiffusion coefficients of Cu6Sn5 and Cu3Sn intermetallic compounds” by Li, Jianfeng, Agyakwa, Pearl A., Johnson, C. Mark

    Published 2016
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  3. 3
    Design tools for rapid multidomain prototyping of power electronic systems

    Design tools for rapid multidomain prototyping of power electronic systems by Evans, Paul L., Castellazzi, Alberto, Johnson, C. Mark

    Published 2016
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  4. 4
    Application of coupled electro-thermal and physics-of-failure-based analysis to the design of accelerated life tests for power modules

    Application of coupled electro-thermal and physics-of-failure-based analysis to the design of accelerated life tests for power modules by Musallam, Mahera, Yin, Chunyan, Bailey, Chris, Johnson, C. Mark

    Published 2014
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  5. 5
    Quantification of cracked area in thermal path of high-powermulti-chip modules using transient thermal impedance measurement

    Quantification of cracked area in thermal path of high-powermulti-chip modules using transient thermal impedance measurement by Eleffendi, Mohd. Amir, Yang, Li, Agyakwa, Pearl, Johnson, C. Mark

    Published 2016
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  6. 6
    Efficiency evaluation of fully integrated on-board EV battery chargers With nine-phase machines

    Efficiency evaluation of fully integrated on-board EV battery chargers With nine-phase machines by Bodo, Nandor, Levi, Emil, Subotic, Ivan, Espina, Jordi, Empringham, Lee, Johnson, C. Mark

    Published 2016
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  7. 7
    Electrical performance and reliability characterization of a SiC MOSFET power module with embedded decoupling capacitors

    Electrical performance and reliability characterization of a SiC MOSFET power module with embedded decoupling capacitors by Yang, Li, Li, Ke, Dai, Jingru, Corfield, Martin, Harris, Anne, Paciura, Krzysztof, O'Brien, John, Johnson, C. Mark

    Published 2018
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  8. 8
    Cost effective direct-substrate jet impingement cooling concept for power application

    Cost effective direct-substrate jet impingement cooling concept for power application by Mouawad, Bassem, Abebe, Robert, Skuriat, Robert, Li, Jianfeng, De Lillo, Liliana, Empringham, Lee, Johnson, C. Mark, Roberts, Andy, Clarke, Robert, Haynes, Geoff

    Published 2018
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