Search Results - Elliot, A.D.T.

Co-design/simulation of flip-chip assembly for high voltage IGBT packages by Rajaguru, P., Bailey, Christopher, Aliyu, Attahir Murtala, Castellazzi, Alberto, Pathirana, V., Udugampola, N., Trajkovic, T., Udrea, F., Mitchelson, P.D., Elliot, A.D.T.

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