Search Results - Dai, Jingru

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  1. 1
    Process and reliability of die attachment by time-reduced sintering of nanosilver film

    Process and reliability of die attachment by time-reduced sintering of nanosilver film by Dai, Jingru

    Published 2019
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  2. 2
    Comparison of power cycling reliability of flexible PCB interconnect smaller/thinner and larger/thicker power devices with topside Sn-3.5Ag solder joints

    Comparison of power cycling reliability of flexible PCB interconnect smaller/thinner and larger/thicker power devices with topside Sn-3.5Ag solder joints by Li, Jianfeng, Dai, Jingru, Johnson, Christopher Mark

    Published 2018
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  3. 3
    Time-efficient sintering processes to attach power devices using nanosilver dry film

    Time-efficient sintering processes to attach power devices using nanosilver dry film by Dai, Jingru, Li, Jianfeng, Agyakwa, Pearl, Johnson, Christopher Mark

    Published 2017
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  4. 4
    Comparative thermal and structural characterization of sintered nano-silver and high-lead solder die attachments during power cycling

    Comparative thermal and structural characterization of sintered nano-silver and high-lead solder die attachments during power cycling by Dai, Jingru, Li, Jianfeng, Agyakwa, Pearl, Corfield, Martin, Johnson, Christopher Mark

    Published 2018
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  5. 5
    Improved reliability of planar power interconnect with ceramic-based structure

    Improved reliability of planar power interconnect with ceramic-based structure by Zhang, Hui, Li, Jianfeng, Dai, Jingru, Corfield, Martin, Liu, Xuejian, Liu, Yan, Huang, Zhengren, Johnson, Christopher Mark

    Published 2018
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  6. 6
    Electrical performance and reliability characterization of a SiC MOSFET power module with embedded decoupling capacitors

    Electrical performance and reliability characterization of a SiC MOSFET power module with embedded decoupling capacitors by Yang, Li, Li, Ke, Dai, Jingru, Corfield, Martin, Harris, Anne, Paciura, Krzysztof, O'Brien, John, Johnson, C. Mark

    Published 2018
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