Search Results - Corfield, Martin

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  1. 1
    Interconnect materials enabling IGBT modules to achieve stable short circuit failure behavior

    Interconnect materials enabling IGBT modules to achieve stable short circuit failure behavior by Li, Jianfeng, Yaqub, Imran, Corfield, Martin, Johnson, Christopher Mark

    Published 2017
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  2. 2
    A non-destructive study of crack development during thermal cycling of Al wire bonds using x-ray computed tomography

    A non-destructive study of crack development during thermal cycling of Al wire bonds using x-ray computed tomography by Agyakwa, Pearl, Yang, Li, Corfield, Martin, Johnson, Christopher Mark

    Published 2014
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  3. 3
    Predicting lifetime of thick Al wire bonds using signals obtained from ultrasonic generator

    Predicting lifetime of thick Al wire bonds using signals obtained from ultrasonic generator by Arjmand, Elahjeh, Agyakwa, Pearl, Corfield, Martin, Li, Jianfeng, Johnson, Christopher Mark

    Published 2016
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  4. 4
    Comparative thermal and structural characterization of sintered nano-silver and high-lead solder die attachments during power cycling

    Comparative thermal and structural characterization of sintered nano-silver and high-lead solder die attachments during power cycling by Dai, Jingru, Li, Jianfeng, Agyakwa, Pearl, Corfield, Martin, Johnson, Christopher Mark

    Published 2018
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  5. 5
    Damage evolution in Al wire bonds subjected to a junction temperature fluctuation of 30 K

    Damage evolution in Al wire bonds subjected to a junction temperature fluctuation of 30 K by Agyakwa, Pearl, Yang, Li, Arjmand, Elahjeh, Evans, Paul, Corfield, Martin, Johnson, Christopher Mark

    Published 2016
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  6. 6
    Built-in reliability design of highly integrated solid-state power switches with metal bump interconnects

    Built-in reliability design of highly integrated solid-state power switches with metal bump interconnects by Li, Jianfeng, Castellazzi, Alberto, Dai, Tianxiang, Corfield, Martin, Solomon, Adane Kassa, Johnson, Christopher Mark

    Published 2015
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  7. 7
    Built-in reliability design of highly integrated solid-state power switches with metal bump interconnects

    Built-in reliability design of highly integrated solid-state power switches with metal bump interconnects by Li, Jianfeng, Castellazzi, Alberto, Dai, Tianxiang, Corfield, Martin, Solomon, Adane Kassa, Johnson, Christopher Mark

    Published 2015
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  8. 8
    Comparison of thermal and reliability performance between a SiC MOSFET module with embedded decoupling capacitors and commercial Si IGBT power modules

    Comparison of thermal and reliability performance between a SiC MOSFET module with embedded decoupling capacitors and commercial Si IGBT power modules by Yang, Li, Agyakwa, Pearl, Corfield, Martin, Johnson, Mark, Harris, Anne, Packwood, Matthew, Paciura, Krzysztof

    Published 2018
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  9. 9
    A thermal cycling reliability study of ultrasonically bonded copper wires

    A thermal cycling reliability study of ultrasonically bonded copper wires by Arjmand, Elaheh, Agyakwa, Pearl A., Corfield, Martin R., Li, Jianfeng, Mouawad, Bassem, Mark Johnson, C.

    Published 2016
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  10. 10
    Improved reliability of planar power interconnect with ceramic-based structure

    Improved reliability of planar power interconnect with ceramic-based structure by Zhang, Hui, Li, Jianfeng, Dai, Jingru, Corfield, Martin, Liu, Xuejian, Liu, Yan, Huang, Zhengren, Johnson, Christopher Mark

    Published 2018
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  11. 11
    Electrical performance and reliability characterization of a SiC MOSFET power module with embedded decoupling capacitors

    Electrical performance and reliability characterization of a SiC MOSFET power module with embedded decoupling capacitors by Yang, Li, Li, Ke, Dai, Jingru, Corfield, Martin, Harris, Anne, Paciura, Krzysztof, O'Brien, John, Johnson, C. Mark

    Published 2018
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