Search Results - Baserfalak, F.

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    Microstructural evaluation of Bi-Ag and Bi-Sb lead-free high-temperature solder candidates on copper substrate with multiple reflow number

    Microstructural evaluation of Bi-Ag and Bi-Sb lead-free high-temperature solder candidates on copper substrate with multiple reflow number by Nahavandi, Mahdi, Mohamed Ariff, Azmah Hanim, Zahari, Nur Ismarrubie, Baserfalak, F.

    Published 2014
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  2. 2
    Interfacial reaction of Bi–Ag and Bi–Sb solders on copper substrate with multiple reflow number

    Interfacial reaction of Bi–Ag and Bi–Sb solders on copper substrate with multiple reflow number by Nahavandi, Mahdi, Mohamed Ariff, Azmah Hanim, Zahari, Nur Ismarrubie, Baserfalak, F.

    Published 2014
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