Search Results - Agyakwa, Pearl A.

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  1. 1
    Physics-of-failure lifetime prediction models for wire bond interconnects in power electronic modules

    Physics-of-failure lifetime prediction models for wire bond interconnects in power electronic modules by Yang, Li, Agyakwa, Pearl A., Johnson, C. Mark

    Published 2013
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  2. 2
    Response to comments on “A numerical method to determine interdiffusion coefficients of Cu6Sn5 and Cu3Sn intermetallic compounds”

    Response to comments on “A numerical method to determine interdiffusion coefficients of Cu6Sn5 and Cu3Sn intermetallic compounds” by Li, Jianfeng, Agyakwa, Pearl A., Johnson, C. Mark

    Published 2016
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  3. 3
    A thermal cycling reliability study of ultrasonically bonded copper wires

    A thermal cycling reliability study of ultrasonically bonded copper wires by Arjmand, Elaheh, Agyakwa, Pearl A., Corfield, Martin R., Li, Jianfeng, Mouawad, Bassem, Mark Johnson, C.

    Published 2016
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